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Among the challenges that should be discussed early with your fabrication partner are:

• How much will the circuit have to bend?
• How much tension will be applied in the application?
• How much shock and vibration must the circuit withstand?
• What about acceleration loads?
• Is the circuit subject to high humidity?
• What about contact with liquids?

These challenges must be taken into account when deciding how to deal with design factors — like line density and number of board layers — as well as more process-oriented decisions like which fabrication materials and process steps to use.

Both methods are used to create circuit lines on a surface. A subtractive technology creates circuit lines by subtracting or removing material — in this case, metal from a surface pre-bonded to a non-metallic polyimide base. An additive process creates circuit lines by sputtering a positively charged metal to a negatively charged base. A large part of what gives additive processing all the advantages listed above is photolithography lines will be more precisely defined, have greater resolution and line uniformity; meaning greater component reliability, especially at much smaller scale.